BGY-608

Parameter

  • 商品详情

Application:

Used in silicon wafer polishing, glass polishing, LCD-TFT polishing, crystal polishing, etc. Nano-cerium oxide polishing slurry adopts nano-dispersion technology to disperse nano-cerium oxide powder in aqueous medium to form dispersion, homogenization and stabilization. The nano-cerium oxide polishing slurry has the characteristics of good suspension stability, uniform particles, good polishing rate, and excellent surface performance .


Technical parameter:

Parameter

Particle size

80-100nm

PH value

6-8

Solid content

20%

Color

Milky white

Packing

5KG/pail 20KG/pail


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